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µChem 410 Product Info, MSDS, MSDS 1, MSDS 2 |
Easy to handle nickel sulfamate electrolyte for usage in micro technology. Nickel layers without inner stress will be deposited out of the electrolyte, which is ready to use and already worked in. |
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µChem 450 Product Info, MSDS, MSDS 1, MSDS 2, MSDS 3, MSDS 4 |
Nickel/iron-electrolyte, especially developed for micro technology, deposites Ni/Fe-alloy layers with iron contents of up to 45 %, adjustable by addition of iron salt µChem 450/1. |
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µChem 510 Product Info, MSDS |
Alcaline cyanide free copper electrolyte for direct plating onto nickel, nickel alloys, zinc, brass and oxidised titanium in micro technology. The electrolyte is ready to use and deposites matte to semi bright Cu-layers with excellent covering and spreadability. Afterwards, it can be plated with nickel, acid copper or used for selective wet etching processes. |
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µChem 520 Product Info, MSDS, MSDS 1 |
Acid copper electrolyte for micro technology, deposites matte, fine crystalline copper layers, which are free of pores and inner stress. Especially suited for feeding of mould cavities. |